Seoul: Samsung Electronics Co. announced that it has started shipping samples of its latest high-bandwidth memory (HBM) chip, the 12-layer HBM4E. This marks the first global shipment of the next-generation artificial intelligence (AI) memory product.
According to Qatar News Agency, this development comes three months after Samsung began mass production and shipments of its sixth-generation HBM4 chips. This move highlights Samsung's commitment to maintaining its leadership position in the expanding AI memory market.
The company states that the HBM4E chip offers industry-leading performance, achieved through optimized chip design and manufacturing processes. The chip supports data transfer speeds of up to 16 gigabits per second per pin, which is over 20 percent faster than the previous HBM4 lineup. Additionally, it provides a bandwidth of up to 3.6 terabytes per second per stack, facilitating faster processing speeds for large language models and next-generation AI systems.
Hwang Sang-joon, head of memory development at Samsung Electronics, said in a press release, "Following the successful mass production of HBM4, Samsung has completed the shipment of next-generation HBM4E samples without disruption, further solidifying its technological leadership in the market."
Samsung plans to begin mass production of the HBM4E according to customer schedules following the sample shipments. The company's clientele includes major AI firms such as Advanced Micro Devices (AMD) Inc., Nvidia, and Google.